Preface

Programmable logic devices are offered in various package types. There are some basic package types subdevided into subtypes with different kinds of materials (plastic, ceramic, ...) or different pin-to-pin spacings (0,5mm, 0,65mm, ...) or something else. The typical used basic package types are shown in the package-tree below. Consider that often abbreviated package names are extended by the number of pins, like PQ208 or PQFP208.
Normally the die inside of the package is assembled "Cavity-Up", that means the die is attached against the inside bottom of the package. For better thermal characteristics the die is sometimes attached against the inside top of the package, so called "Cavity-Down". Cavity-Down assembled packages are usually especially marked.